What is COB Package technology?
COB package is called Chips on Board (COB), which is a technology to solve the problem of LED heat dissipation. Compared with in-line and SMD, it is characterized by saving space, simplifying packaging operations, and has an efficient thermal management method.
The COB package is chip on board, which is to stick the bare chip on the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to achieve its electrical connection. If the bare chip is directly exposed to the air, it is susceptible to pollution or artificial damage, which affects or destroys the function of the chip, so the chip and the bonding wire are encapsulated with glue. People also call this form of packaging soft package.
Cabinet size: 608mmW*342mmH (0.2079 SQM); Cabinet resolution: 384*216 Pixels;
1920*1080 2K Resolution: 5PCS*5PCS=25 PCS (5.1975 SQM) ; Screen size: 3040mmW*1710mmH;
3840*2160 4K Resolution: 10PCS*10PCS=100 PCS (20.79 SQM) ; Screen size:6080mmW*3420mmH;